Meet Inspiring Speakers and Experts at our 3000+ Global Conference Series Events with over 1000+ Conferences, 1000+ Symposiums
and 1000+ Workshops on Medical, Pharma, Engineering, Science, Technology and Business.

Explore and learn more about Conference Series : World's leading Event Organizer

Back

Akira Ishibashi

Akira Ishibashi

Hokkaido University, Japan

Title: Clean unit system platform in

Biography

Biography: Akira Ishibashi

Abstract

New devices and systems in materials science (atoms), information technology (bits), energy, renewable energy, and environment engineering having been of increasing importance, it would be convenient for us to investigate those new devices and systems in the four-dimensional space of atom-bit-energy/environment (ABE2) space. We have been studying quantum-cross devices in atom-bit (AB)-plane, multi-striped orthogonal photon-photocarrier-propagation solar cell (MOP3SC) in bit-energy (BE)-plane, and clean unit system platform (CUSP) in atom-environment (AE)-plane. The CUSP, being itself a key player in AE plane of the ABE2 space as a clean versatile environment of ISO class -1 to 5 having small footprint, low power-consumption and high cost-performance can serve as the next generation production system and future cross-disciplinary platforms including the one for kinetosomnogram. Multiply-connected CUSP system will outperform conventional clean room only for nanotechnologies or bio-technologies but also for the next-generation environment-friendly healthcare platform. Since extremely high cost-performance in industrial and social activities means “cost/performance ~ 0”, which could be a counterpart of “mass ~ 0” in physics, CUSP would be able to serve as a “Nambu-Goldstone boson” to make a social phase transition for our better world in terms of maintaining high QOL and postponing the time when elder people might get into medical cares. The CUSP in AE plane, outperforming the conventional super clean room (“main frame”), would be the clean space for all of us in near future.